Yokneam is fast becoming one of the major centers of core semiconductor technologies.
Yokneam is fast becoming one of the major centers of core semiconductor technologies. After Marvell acquired Galileo Technologies in 2000 for $2.7 billion, the Yokneam site became Marvell's R&D site in Israel.
In addition to these acquisitions, Yokneam is home to a number of other companies in the semiconductor field.
Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).
ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, annular blades and process know-how we bring our customers comprehensive dicing solutions.
ColorChip, established in 2001, is a pioneer and a world leading innovator in the fields of integrated optical components and sub-systems.
ColorChip technology enables reliable, scalable and robust high speed networking and communications solutions.
Through our two product lines, we deliver industry leading high speed opticaltransceivers to the Datacom/Telecom markets and PLC splitters to the FTTx markets.
Since its inception, ColorChip has been dedicated to the Research and Development of advanced Application Specific Photonic Integrated Circuits (ASPICs). A team of university professors and industry veterans have collaborated for over a decade to optimize Planar-Lightwave-Circuit (PLC) technology towards the realization of Best-of-Breed high performance PLCs. In time, ColorChip has perfected the process and has become a world leading supplier of Advanced PLC products.
Planar-Lightwave-Circuits are at the heart of ColorChip’s SystemOnGlass™ Photonic Integration technology using the glass as a platform to combine both passive and active components. SystemOnGlass™ integration is at the core of ColorChip’s compact, high performance, single mode fiber transceiver portfolio.
Maradin Ltd. provides innovative MEMS laser scanning mirrors and controllers for a wide range of applications, including pico-projectors, automotive heads up display (HUD), medical devices, industrial devices, defense instruments and more.
From Storage to Networking, cloud infrastructure, Internet of Things (IoT), digital entertainment and in-home content delivery, Marvell’s diverse product portfolio aligns complete platform designs, with industry-leading performance, security, reliability and efficiency.
The Israeli operations are focused on Networking is comprised of two product line groups: Communication Switches and System-on-Chip (SoC).
Mellanox Technologies (NASDAQ: MLNX) is a leading supplier of end-to-end InfiniBand and Ethernet interconnect solutions and services for servers and storage. Mellanox interconnect solutions increase data center efficiency by providing the highest throughput and lowest latency, delivering data faster to applications and unlocking system performance capability.
Mellanox offers a choice of fast interconnect products: adapters, switches, software and silicon that accelerate application runtime and maximize business results for a wide range of markets including high performance computing, enterprise data centers, Web 2.0, cloud, storage and financial services.
MAT is a Die Attach and Dispensing equipment manufacturer specializing in providing machines and turn-key solutions for most advanced die attach and dispensing applications.
Our main products are the High Accuracy Model 6400 Die Attach System, the new Model 6200 Table-Top Automatic Die Attach System and Model 6410 Automatic Dispensing System. We still support the previous Model 6495/6/7 Semi-Automatic and Model 6900/6920 High Volume Production Systems.
MAT is a dynamic team of engineers and applications specialists with many years of experience in the field of die attach equipment. Our specific strengths are with complex, high value applications such as Multi Chip Modules, SIP, Imaging devices, Sensors, MEMS devices, Flip Chip.
Micro-Point Pro has established itself as a global leader in the Semiconductor marketplace, in both the back & front end. MPP offers comprehensive solutions to suit an ever growing range of custom requests for high-precision expendable tools for the Micro-Electronics industry for all major packaging processes. MPP is also a world leader in Probe Heads that measure resistivity of wafers or thin conductive films.
With sophisticated and unique manufacturing equipment, along with patented coating technologies, MPP provides high quality solutions with the best cost of ownership, allowing customers to rapidly overcome the new demanding challenges of the industry.
PLSense technology extends the battery life by a factor of 3-5X in real applications. Usage of the PLSense technology will bring ultra-low power devices to mainstream IoT and other high-volume applications.
The majority of the emerging tens of billions of connected Internet-of-Things (IoT) devices are battery operated. Devices such as Wearable well-being devices, smart-home sensors and actuators, always-on sensors in mobile devices, hearing aids etc. will surround us anywhere, anytime.
Reducing the power consumption of the silicon powering these applications extends the battery life, reduces the frequency of battery replacement, enables richer feature-set of the devices and enables usage of smaller and lighter batteries.
The operating voltage of standard solutions is well above the Threshold Voltage (VT) of the silicon, enabling fast and robust operation between cut-off (“0”) and saturation (“1”). PLSense technology enables reducing the operating voltage to Near-Threshold or Sub-Threshold levels. This significantly reduces the power consumption and saves 70-80% of the dynamic power consumption and over 80% of the leakage power.
PLSense technology and products overcome the technological and commercial challenges associated with the Near/Sub Threshold domain.
Ramon Chips is a fabless semiconductor company focused on developing unique Radiation Hardened VLSI /ASIC solutions for space applications. Their silicon proven RadSafe™ technology provides extreme high immunity to all space radiation effects in LEO, GEO and outer space missions, while maintaining high density, high performance and low power.
RAMON CHIPS developed a unique technology for implementing Rad-Hard By Design (RHBD) electronic components. The technology and Intellectual Property cores were tested for radiation immunity, and passed in excess of 300 Krad(Si) TID and 100 MeV/(mg/cm2) SEL and SEU tests, rendering the technology suitable for LEO, GEO and outer space applications. Devices are qualified to either Class Level S or a proprietary LEO level.
SELA develops and manufactures automated scanning electron microscope (SEM) and transmission electron microscope (TEM) sample preparation equipment for the semiconductor and optical components industries.
CPC Solutions is a leading Company specializing in the design, engineering and manufacturing of custom Human Machine Interface (HMI) Products.
CPC Solutions is a privately owned corporation, established in 1984 by Dov Harpaz, and presently has over 150 employees.
The company develops and manufactures custom products, such as control systems, illuminated displays, keyboard types, flat cables and heaters.
Our focused industry sectors are Defense, Aerospace, Medical and Civil-High end, further proving our commitment to serving this exciting and demanding industries.
Our full range Solutions allow our customers to improve time-to-market, obtain the best overall cost, reduce product cycle time, optimize resources, maintain world-class manufacturing capabilities.
With our turnkey services we can offer our customers a competitive advantage in a constantly evolving marketplace where speed, innovation and agility are critical
CPC's cutting edge, custom Human Machine Interface (HMI) designs and assemblies are the face of many leading OEM’s products.